SC = Single supply, compact featuresSF = Single supply, flash featuresSA = Single supply, analog featuresSL = Single supply, flash features with RSU optionDC = Dual supply, compact featuresDF = Dual supply, flash featuresDA = Dual supply, analog featuresDD = Dual supply, analog and flash features with RSU option and flash access control
WLCSP package type:36 = 36-ball, 3mm x 3mm81 = 81-ball, 4mm x 4mm180 = 180-ball, 6mm x 5mmEQFP package type:144 = 144-pin, 22mm x 22mmMBGA package type:153 = 153-ball, 8mm x 8mmUBGA package type:169 = 169-ball, 11mm x 11mm324 = 324-ball, 15mm x 15mmFBGA package type:256 = 256-ball, 17mm x 17mm484 = 484-ball, 23mm x 23mm672 = 672-ball, 27mm x 27mm
X
Operating Temperature
C = Commercial (0°C to 85°C)I = Industrial (-40°C to 100°C)A = Automotive (-40°C to 125°C)
X
FPGA Fabric Speed Grade
6 = fastest78
X
Optional Suffix
- indicates specific device options or shipment methodG = RoHS6ES = Engineering sampleP = Leaded package
Note: Part number description table describes usual part-numbering system for more chips, therefore this table can contain information, that might not be valid for the actually selected chip. The information here are provided on the best-effort basis and might be either inaccurate or incoplete. Therefore always check the latest datasheet of the chip for part number description detail. If you find some inaccuracy, let us please know.